In its future iPhones, Apple is reportedly planning to use Qualcomm’s new fingerprint reader. According to MacRumors, citing Economic Daily News, the tech giant is working with Taiwanese touchscreen manufacturer GIS to build an iPhone for 2020 or 2021 that can use the under-display technology.
During its third annual Snapdragon Technology Summit, Qualcomm revealed its latest 3D Sonic Max fingerprint reader earlier Tuesday. The latest version measures 20 mm by 30 mm compared to the 4 mm Qualcomm by 9 mm ultrasonic fingerprint scanner used on the Samsung Galaxy S10 and Galaxy Note 10.
The history of the tech giant working on mobile chips with Qualcomm is long and complex. Initially, Apple used German company Infineon modems when it launched the iPhone for the first time, before switching to Qualcomm in 2011. Intel then bought Infineon in 2011, but those chips weren’t used again until the iPhone 7 and iPhone 7 Plus in 2016 after a dispute over Qualcomm’s licensing fees.
When Apple and Qualcomm settled their legal battle and reached a multiyear 5 G chip deal in April this year, Intel exited the 5 G phone modem business.